System Architecture

The B Series consists of two main components — the COMM board at the bottom (including power supply) and the I/O modules on top, communicating via a backplane bus. Up to 4 I/O slots can be installed per housing.

Supported Communication Protocols

The COMM board can be selected to match any controller or network — choose the protocol that fits your system:

I/O Module Types

• Digital Input (DI) — 16 channels, 24VDC, NPN/PNP
• Digital Output (DO) — 16 channels, 24VDC/0.5A, NPN/PNP
• Analog Input (AI) — voltage/current, 12-bit or 16-bit
• Analog Output (AO) — voltage/current, 16-bit
• Temperature Input — RTD PT100/PT1000, thermocouple TC types
• Encoder Input — orthogonal/pulse, 5V or 24V single-ended
• Mixed I/O — combined DI + DO in one module

Key Features

• Modular combination — COMM board and I/O modules freely combined based on site requirements
• Up to 4 I/O expansion slots per housing (B32: 32-channel / B64: 64-channel)
• Compact, cost-effective solution for low to medium data point counts
• Shared backplane bus — no inter-module wiring required
• Wide operating temperature range: -20°C to +70°C
• DIN rail installation
• CE / RoHS / cULus certified

Applications

• Machine automation with compact I/O requirements
• Cabinet-mounted control panels with limited space
• Distributed I/O nodes in PROFINET / EtherCAT / Modbus networks
• Solar, energy storage, water treatment and pharmaceutical applications
• Any application requiring flexible protocol support with low I/O count